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large litho

Ideal as a dual-use (lithography and via-generation) system

The Anvik HexScanTM 2150 SXE patterning system represents a revolutionary advance in large-format lithography and via-generation systems. It offers the unique combination of high-resolution projection imaging and large-area substrate handling, making it the ideal patterning tool for high-volume, cost-effective production of microelecronic modules and printed circuits. With its excimer laser source emitting 50 watts of UV radiation, this low-cost system serves both as a volume-production resist lithography tool, and as a high-speed, batch via-generation system for dielectric layers.

Anvik HexScanTM 2150 SXE

Large-format substrate handling

* Designed for projection patterning of substrate sizes of 460 x 610 mm (18 x 24 inches) and larger (1100 x 1250 mm); scalable to 1500 x 1800 mm.
* Capable of handling substrates of a wide range of thicknesses
* Fully automated handling and mask-substrate alignment minimizes overhead time

High resolution

* Resolution of 15 microns (0.6 mil) (lines, spaces, holes)
* Patented seamless scanning technology (HexScanTM) delivers lens resolution over entire panel
* High resolution enables excellent line-edge definition and via profiles

Very high exposure throughput

Exposure throughputs as high as 180 panels/hr (12 x 12 inch panels), made possible by

* Seamless scanning with hexagonal illumination
* High-power excimer laser illumination system
* High-speed, high-precision scanning stage

Versatility

* Delivers very high throughput for lithography in a wide range of photoresist materials
* Capable of high-speed, batch via generation in a variety of polymeric dielectrics
* Available with Anvik's patented Variable-Area Substrate Tiling (VASTTM) technology

Modularity and upgradability

* Modular design enables user to define optimum system configuration
* Customer may specify resolution, substrate size parameters and exposure wavelength
* Upgradability of key subsystems extends system life over multiple product generations

 

HexScanTM 2150 SXE Specifications

Imaging Technique Seamless scanning projection
Resolution 15 microns (0.6 mil)
Projection System 1:1 magnification refractive lens
Depth of Focus 1.3 mm (50 mils)
Substrate Size Up to 1100 x 1250 mm (44 x 50 in), with or without tiling
Illumination Source XeF excimer laser (other sources optional)
Exposure Wavelength 351 nm (other wavelengths optional)
Overlay Precision 3 microns
Alignment System Automatic
Panel and Mask Handling Automatic
Exposure Throughput >160 panels/hr (12 x 12 in panels)

Lithography | Electron beam lithography | Printmaking : Lithograpy | Large area lithography |
Selecting the right paper | Applications Of Litho Printing | Lithographic Printing Process